简介:
ICS 105 set 是由德国 Langer – EMV 生产并由深圳EUTTEST代理销售的集成电路扫描仪测试系统,系统内包含的 ICS 105 可以对小型IC((50x50x50) mm空间范围)和小型PCB近场高频近场测量,空间分辨率高达50μm,可选配 1.5MHz 至 6GHz的H场和E场探头用于产品的CI集成电路或小型PCB进行测试。

ICS 105 set 系统测试图
发货清单:
- ICS 105 set 是一个集成电路近场扫描测试系统,包含以下部件:
- 1x ICS 105主机
- 1x CS-Scanner, ChipScan-Scanner 软件
- 1x GND 25, 符合IEC61967标准的接地板
- 1x DM-CAM 高分辨率相机
- 1x ICS 105 acc 附件
- 1x ICS Flight case 包装箱
技术参数:
设备供电电压 | 110V或220V |
电脑通讯端口 | USB |
最大移动空间 | (X轴 x Y轴 x Z轴) mm (50 x 50 x 50) mm / α-Rotation ±180° |
最小移动空间 | (X轴 x Y轴 x Z轴) mm (10 x 10 x 10) µm / α-Rotation 1° |
移动速度 | (X轴 x Y轴 x Z轴) mm (2 x 2 x 2) mm/s / α-Rotation 45°/s |
重量 | 23kg |
规格大小 | 350 mmx 400mm x 420mm |
ICS105 set的可选附件
<<<<提醒:左右滑动表格>>>>E场探头 | ICR E150 set 微型近场探头 ICR E150:可用频率7 MHz – 3 GHz |
H场探头 | 磁场探头;配合ICS 105使用; ICR HH H Field(接收垂直方向的磁场线); HH100中的“100” 代表 探头 尖端 的 内部 直径( μ m) ICR HH H Field(接收垂直方向的磁场线) HH100代表探头尖端的内部直径(μm); ICR HH100-27:可用频率 1.5 MHz – 6 GHz ICR HH100-6:可用频率 2.5 MHz – 6 GHz ICR HH150-27:可用频率1.5 MHz – 6 GHz ICR HH150-6:可用频率 2.5 MHz – 6 GHz ICR HH250-6:可用频率 2.5 MHz – 6 GHz ICR HH250-75:可用频率 0.5 MHz – 2GHz ICR HH500-6:可用频率 2 MHz – 6 GHz ICR HH500-75:可用频率 200kHz – 1 GHz ICR HV H Field(接收水平方向的磁场线) HV100代表探头尖端的内部直径(μm); ICR HV100-27:可用频率 1.5 MHz – 6 GHz ICR HV100-6:可用频率 2.5 MHz – 6 GHz ICR HV150-27:可用频率1.5 MHz – 6 GHz ICR HV150-6:可用频率 2.5 MHz – 6 GHz ICR HV250-6:可用频率 2.5 MHz – 6 GHz ICR HV250-75:可用频率 0.5 MHz – 2GHz ICR HV500-6:可用频率 2 MHz – 6 GHz ICR HV500-75:可用频率 200kHz – 1 GHz |
手持探头 含电场和磁场 LFS 序列(<50MHz) RFS序列(<3GHz) XFS 序列(<6GHz) | 手持探头;手持探头可以卡在 ICS 105 set 支架上,也可以手持使用序列一、LFS, Passive, 100 kHz up to 50 MHzLFS-B 3: 100 kHz up to 50 MHz 序列二、RFS, Passive, 30 MHz up to 3 GHzRFS扫描探头组包含三个无源近场探头,用于在研发阶段扫描测量电场和磁场,频率范围为30MHz到3GHz。该探头组的探头可以实现紧贴电子模块测量,从而定位干扰信号源。它们记录受测物的近电场和近磁场的整个图形。该扫描探头组具备外片电流衰减和电屏蔽。扫描探头可以接到频谱分析仪或示波器的50Ω输入端。探头内部没有50Ω的终端阻抗。扫描探头的测量信号可以通过PA 203或PA 303型前置放大器放大。根据需求生产RFS,LFS,SXS 和XFS型扫描探头。 以下RFS序列不同的探头均具有不同的探头尺寸,可以按需选购或全配置。 RFS-R 50-1, Scanner Probe 30 MHz up to 3 GHzThe RFS-R 50-1 H-field probe is designed for taking field measurements on assemblies, devices or cables at a distance of up to approx. 3 cm. The H-field probe can be used to identify larger components as sources of interference. RFS-R 3-2, Scanner Probe 30 MHz up to 3 GHz RFS-R 0.3-3, Scanner Probe 30 MHz up to 3 GHzRFS-B 3-2, Scanner Probe 30 MHz up to 3 GHzThe measurement coil of the RFS-B 3-2 H-field probe is arranged orthogonally to the probe shaft. This allows the probe head to be positioned very close to the assembly and to achieve a strong coupling. The RFS-B 3-2 detects magnetic field lines, which exit the measuring object othogonally. Magnetic … RFS-B 0.3-3, Scanner Probe 30 MHz up to 3 GHzRFS-E 02, Scanner Probe 30 MHz up to 3 GHzRFS-E 03, Scanner Probe 30 MHz up to 3 GHzUsing the approx. 4×4 mm electrode, which is located in the bottom of the RFS-E 03 probe head, E-fields from clocked lines, IC pins, and smaller components can be detected. RFS-E 05, Scanner Probe 30 MHz up to 3 GHzRFS-E 10, Scanner Probe 30 MHz up to 3 GHz序列三、XFS, Passive, 30 MHz – 6 GHz以下XFS序列不同的探头均具有不同的探头尺寸,可以按需选购或全配置。 XFS-R 3-1, Scanner Probe 30 MHz up to 6 GHzThe XFS-R 3-1 near-field probe is designed for direct high-resolution measurements of RF magnetic fields on an assembly, e.g. around the pins and IC cases, conducting paths, decoupling capacitor, and EMC components. XFS-B 3-1, Scanner Probe 30 MHz up to 6 GHzThe measurement coil of the XFS-B 3-1 H-field probe is set at a 90° angle to the probe shaft. By positioning the probe head vertically, the measurement coil touches the surface of the printed circuit board directly. This allows for use at places on the surface of printed circuit boards, which are t… XFS-E 10, Scanner Probe 30 MHz up to 6 GHzThe electrode in the probe head of the XFS-E 10 has a width of approx. 0.2 mm. With the probe even smallest E-field sources can be located, e.g. conducting paths with a width of 0.1 mm or single pins on multi pinned ICs. To measure, the E-field probe is positioned onto the object. XFS-E 09s, Scanner Probe 30 MHz up to 6 GHzThe electrode on the probe head of the XFS-E 09 detects electrical fields which, for example are decoupled above the IC’s surface. The probe’s resolution allows for measurements with a distance of 0.5 mm to 10 mm above an assembly. |