IEC 61967-2 Electromagnetic Emission TEM Cell Test Method for Integrated Circuits 150 kHz-1 GHz Standard Analysis

Standards Profile:

IEC 61067-2 defines a method for measuring electromagnetic emissions from integrated circuits (ICs). The IC being evaluated is mounted on an IC test printed circuit board (PCB) that is clamped to a mating port (called a wall port) cut at the top or bottom of a transverse electromagnetic (TEM) or broadband gigahertz TEM (GTEM) chamber. Instead of the test board being located inside the TEM CELL as in the traditional method of use, it becomes part of the TEM CELL wall. This method is applicable to any TEM or GTEM chamber modified to incorporate wall ports; however, the measured radio frequency (RF) voltage will be affected by many factors. The main factor affecting the measured RF voltage is the spacing from the septum to the IC test board (cell wall). This procedure was developed using a 1 GHz TEM cell with a septum-to-bottom spacing of 45 mm and a GTEM cell with an average septum-to-bottom spacing of 45 mm over the port area. Other cells may not produce the same spectral output, but can be used for comparative measurements, limited by their frequency and sensitivity. The conversion factor can allow comparisons between data measured on TEM or GTEM chambers with different diaphragm-to-floor spacings. the IC test board controls the geometry and orientation of the operating IC relative to the TEM CELL and eliminates any connecting leads within the TEM CELL (these leads are located on the backside of the board, outside the TEM CELL). For the TEM CELL, one of the 50 ports is terminated with a 50 load. The other 50 port for the TEM CELL or the single 50 port for the GTEM CELL is connected to the input of a spectrum analyzer or receiver that measures the RF emissions emanating from the IC and applied to the diaphragm of the CELL.

Updated standards:

IEC 61967-2 standard check in April 2024

• IEC 61967-2:2005 Measurement of electromagnetic emissions from integrated circuits from 150 kHz to 1 GHz Part 2: Measurement of radiated emissions TEM cell and broadband TEM cell methods.
• IEC 61967-2:2005 Integrated circuits - Measurement of electromagnetic emissions, 150 kHz to 1 GHz - Part 2: Measurement of radiated emissions - TEM cell and wideband TEM cell method

Standards revision history:

Standard Catalog:

Areas of application.10

2 Standard reference 10

3 Terms and definitions12

4 General 12

5 Test conditions12

5.1 Overview12

5.2 Supply voltage12

5.3 Frequency range12

6 Test equipment. 12

6.1 Overview12

6.2 Shielding 12

6.3 Measuring device RF12

6.4 Preamplifiers.14

6.5 TEM unit 14

6.6 Broadband TEM/GTEM units. 14

6.7 Termination of 50Ω14

6.8 System Gain 14

7 Test Installation 14

7.1 Overview14

7.2 Test Configuration 14

7.3 Testing the PCB.16

8 Test program. 22

8.1 Overview22

8.2 Environmental conditions. 22

8.3 Operational validation of EED22

8.4 EED emission measurements22

9 Test report. 24

9.1 Overview24

9.2 Measurement conditions. 24

10 IC emission reference level24

Appendix A (Informative) Calibration and Validation Table Examples

Installation.26

Appendix B (Informational Appendix) Description of TEM Cells and Broadband TEM Cells28

B, 1 TEM unit. 28

B, 2 broadband TEM units. 28

Appendix C (Informative Appendix) Calculation of dipole moments from measured data30

C. 1. Overview30

C, 2. Calculation of dipole moments. 30

Preamble 7

1 Scope. 11

2 Normative references.11

3 Terms and definitions. 13

4 General. 13

5 Test conditions13

5.1 General. 13

5.2 Supply voltage13

5.3 Frequency range13

6 Test equipment 13

6.1 General. 13

6.2 Shielding 13

6.3 RF Measurement Instruments. 13

6.4 Preamplifiers. 15

6.5 TEM batteries15

6.6 Broadband TEM/GTEM units15

6.7 50 ohm termination. 15

6.8 System Gain.15

7 Test Setup 15

7.1 General. 15

7.2 Test configuration. 15

7.3 PCB17 test

8 Test program 23

8.1 General. 23

8.2 Environmental measurements23

8.3 DUT operation check 23

8.4 DUT emission measurements.23

9 Test report 25

9.1 General. 25

9.2 Measurement conditions25

10 IC emission reference level. 25

Example of an Annex A (informative) calibration and setup validation table27

Appendix B (Informative) TEM Unit and Broadband TEM Unit Descriptions.29

B, 1 TEM battery. 29

B. 2 Broadband GTEM units 29

Calculation of dipole moments for Annex C (informative) measurement data.31

C. 1. General 31

C, 2 Dipole moment calculations. 31

Appendix D (Informative) Emission Data Specifications. 34

D. 1. Overview34

D. 2. Regulation of emission levels34

D. 3. Presentation of results34

D. 4 examples34

Bibliography.39

Figure 1 - Test components of a TEM cell.16

Figure 2-Test components of the GTEM unit.16

Figure 3-CI 20 Testing a Printed Circuit Board

Figure D.1 - Emission Characterization Levels. 36

Figure D.2 - Maximum emission levels G8F.38

Table 1-Pin Load Recommendations. 18

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