Introduction：

It is important that users of IC ICs are able to compare various types of ICs based on their EMC parameters and that EMC test program methods and test equipment for IC ICs are specified. This enables the selection of the optimum IC and means that the layout design and devices can be aligned with the EMC parameters of the IC.

For IC manufacturers, good EMC characteristics of their products mean superiority over their competitors. Therefore, IC developers should have a good understanding of EMC test programs and test equipment for IC integrated circuits, with the goal of identifying those parameters that are decisive for EMC immunity and radiation and allow engineers to draw conclusions for chip design.

ICintegrated circuitEMCTest items:

IC EMC test program:

IC integrated circuit EMC test item summary

IC integrated circuit EMC test item summary

You can directly enter the above model number (e.g. P603) into the product search box on the EUTTEST website to check the technical parameters and test methods of the specific product.

As shown above.IC EMC Integrated Circuit Electromagnetic Compatibility Test System There are four different test programs based on different EMC test standards:

  • IC EMI Radiated Emission - Conducted via Wire
  • IC EMI Radiated Emission - Through Spatial Coupling
  • IC EMS Sensitivity Test - Conducted by Wire
  • IC EMS sensitivity testing - through space and coupling (RF and ESD)

The above figure has visualized four different IC EMC test project coupling, IC R & D personnel only need to start from these four aspects of the preparation of EMC test project or in the case of IC emc test system for EMC modification.

Other relevant test items:

  • Nowadays, with reference to human body models, it is common for the ESD strength of electronic components (ICs, transistors) to be quoted in the specifications with values from 1 to a few kV. For human body models (HBM), a capacitor (100 pF) is charged with the test voltage and discharged at the DUT via 1500 Ohm. HBM is described in the standards MIL-STD-883G and IEC 801-2. The Machine Model (MM) is a further test model that works according to the same principle.
  • Both models are used only to verify the IC's resistance to damage when handling components during production, packaging, transportation and assembly. During MM or HBM testing, the test object is never connected to a voltage, i.e. it does not run.
  • The ESD strength specified for the manikin is independent of the ESD behavior during operation. In fact, protection mechanisms designed for mannequins (which do not take into account failures during operation) may even cause ICs to malfunction or fail during functional interference testing.
  • Work is underway on EMC standards, test methods and limits for ICs.
  • The EMC requirements for devices (resources and equipment) are defined in standards, test methods and limits. The devices are tested for ESD and burst testing (IEC standard 61000-4-2/61000-4-4) in the kV range.
  • ICs and other semiconductors used in equipment are ultimately responsible for interference emissions and lack of immunity.
  • The interference emitted by the IC can be measured at its interface and evaluated and defined on the basis of these measurements.
  • The IC has a low immunity level in the Volt range.
  • Pulse voltages introduced outside the device during standard tests are attenuated on their way to the IC. Several kV outside the device are reduced to approximately 1 ... 100 V at the IC pins. These voltages may exceed the immunity level of the IC. This means that the IC must be tested in the range of 1 to several hundred volts instead of in the kV range compared to the device test. Only a few exceptions (special devices) require higher test voltages.

EMC test equipment for IC integrated circuits:

After understanding which EMC test items need to be done for integrated circuits, we are coming to choose the right one according to the test items.IC EMC Test SystemsThe

To test ICs for EMC problems, you need different sets of probes (Figure 3) to determine various EMC parameters, the user can select the following probe sets based on the area of use (including RF, EFT, ESD, DPI, Transmit 1 ohm method ......).

In addition, EUTTEST offers EMC test systems for integrated circuits that meet the requirements of the latest IEC standards and national standards.About IC EMC Test Standards List The

Learn more about: langer IC EMC Test Equipment List

The ICE1 IC test environment needs to be the optimal test environment for the probe set:

  • Test boards for testing ICs, providing a uniform interface between the test IC and the test system
  • CB 0708 Connection Board for Trigger Test ICs
  • GND25 ground plane providing a uniform reference potential
  • In addition, depending on the probe set and the corresponding job, external equipment may be required:
  • Interference generators (e.g. EFT/burst)
  • oscillograph
  • spectrum analyzer
  • PC
  • Power amplifier

The IC under test is located on a test board in the test setup. A filtered connection connects the test board to the CB 0708 connection board located underneath it, which connects the test IC to a PC, allowing the IC to be controlled and monitored using the supplied software. the connection board is integrated in the ground plane, forming a fixed ground reference system for testing. The probes in the probe set are placed on the ground plane and are used to inject interference into the test IC or to measure its emission via conductive or capacitive/inductive coupling. Depending on the respective type, the probe set is powered and controlled by an external interference generator (RF, EFT/burst), a spectrum analyzer, or the Langer-EMV's Burst Power Station (BPS).

Burst power stations are included as accessories in some probe sets. The pulse voltage, pulse frequency and polarity of the probes can be modified using the supplied BPS-Client control software.